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Mechanical Characterization of Pb-Free Solder Bumps
Nanoindentation Measurement of Hardness & Modulus as a Function of Time & Temperature
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Mechanical Characterization of Ultra Low-k Dielectric Films
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Thermal Expansion Study in a TSV-Structure
In-Situ Imaging From 23°C to 400°C in a Controlled Sample Micro-Environment
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Fracture Toughness of SIC
Determined Using Nanoindentation
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Nanoindentation of Tribological Coating on Steel
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In-Situ Electrical Characterization
Nanoindentation of Crystalline Silicon
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Nanoindentation of ZnO Crystals
Using In-Situ SPM Imaging with the Closed Loop Scanner on the TI 950 TriboIndenter®
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Full Nanomechanical Characterization of Ultra-Thin Films
Nanoindenation, Nanoscratch, and ScanningWear™ of TiN Thin Films on the TI 950 TriboIndenter®
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Magnetic Storage Devices
Difference in Hardness of Head Slider Phases
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In-Situ Acoustic Emission Monitoring of Nanoindentation
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MEMS Slider Friction Characterization
Actuation of MEMS Devices with the Hysitron TriboIndenter®
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Nanoscale Adhesion Characterization
Measuring Surface and Film Adhesion Using Nanoindentation
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Nanoindenation of a Three-Layered Optical Fiber
Analysis of Optical Fibers via Quasistatic and Dynamic Nanoindenation of Single Layer
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Depth Profiling
Techniques for Depth Profiling of Materials
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In-Situ Acoustic Emission Monitoring
Of SiC Coating Fracture Induced by Nanoindentation
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