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Applications | by Research Field | Electronics and Semicondutors

MEMS | Characterization of Pb-Free Solder Bumps

 

Mechanical Characterization of Pb-Free Solder Bumps

Nanoindentation Measurement of Hardness & Modulus as a Function of Time & Temperature

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MEMS | Characterization of Ultra Low-k Dielectric Films

 

Mechanical Characterization of Ultra Low-k Dielectric Films

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MEMS | Through Silicon Via (TSV) | Hysitron, Inc.

 

Thermal Expansion Study in a TSV-Structure

In-Situ Imaging From 23°C to 400°C in a Controlled Sample Micro-Environment

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MEMS | Semiconductor Packaging | Hysitron



Industry Solutions: Semiconductor Packaging

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Fracture Toughness | Nanoindentation, Fracture Toughness, Nanomechanical Application Notes | Hysitron

 

Fracture Toughness of SIC

Determined Using Nanoindentation

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Electronics & Semiconductors | Nanoindentation, Tribology, Nanomechanical Application Notes | Hysitron

 

Nanoindentation of Tribological Coating on Steel

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Electronics & Semiconductors | Nanoindentation, In-Situ, Nanomechanical Application Notes | Hysitron

 

In-Situ Electrical Characterization

Nanoindentation of Crystalline Silicon

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Electronics & Semiconductors | Nanoindentation, In-Situ SPM Imaging, Nanomechanical Application Notes | Hysitron

 

Nanoindentation of ZnO Crystals

Using In-Situ SPM Imaging with the Closed Loop Scanner on the TI 950 TriboIndenter®

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Electronics & Semiconductors | Nanoindentation, Nanoscratch, ScanningWear, Nanomechanical Application Notes | Hysitron

 

Full Nanomechanical Characterization of Ultra-Thin Films

Nanoindenation, Nanoscratch, and ScanningWear™ of TiN Thin Films on the TI 950 TriboIndenter®

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Electronics & Semiconductors | Nanoindentation, Hardness, Nanomechanical Application Notes | Hysitron

 

Magnetic Storage Devices

Difference in Hardness of Head Slider Phases

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Electronics & Semiconductors | Nanoindentation, Nanomechanical Application Notes | Hysitron

 

Nanoindentation

Characteristics of Silicon

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Electronics & Semiconductors | Nanoindentation of DLC Coatings | Hysitron

 

Nanoindentation of DLC Coatings

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Electronics & Semiconductors | In-Situ Acoustic Emission Monitoring | Hysitron

 

In-Situ Acoustic Emission Monitoring of Nanoindentation

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Electronics | MEMS Slider Friction Characterization | Hysitron

 

MEMS Slider Friction Characterization

Actuation of MEMS Devices with the Hysitron TriboIndenter®

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Electrical Conductance | Microtribology of Solid Lubricant Coatings | Hysitron



nanoTensile® Investigations of MEMS

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Electronics & Semiconductors | Nanoindentation, Surface Assessment, Nanomechanical Application Notes | Hysitron

 

Nanoscale Adhesion Characterization

Measuring Surface and Film Adhesion Using Nanoindentation

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Electronics & Semiconductors | Nanoindentation, nanoDMA, Nanomechanical Application Notes | Hysitron

 

Nanoindenation of a Three-Layered Optical Fiber

Analysis of Optical Fibers via Quasistatic and Dynamic Nanoindenation of Single Layer

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Electronics & Semiconductors | Nanoindentation, Modulus Mapping, Nanomechanical Application Notes | Hysitron

 

Modulus Mapping™ of a Metal Oxide Film

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Electronics & Semiconductors | Nanoindentation, Depth Profiling, Nanomechanical Application Notes | Hysitron

 

Depth Profiling

Techniques for Depth Profiling of Materials

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Electronics & Semiconductors | In-Situ Acoustic Emission Monitoring | Hysitron

 

In-Situ Acoustic Emission Monitoring

Of SiC Coating Fracture Induced by Nanoindentation

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