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Mechanical Characterization of Pb-Free Solder Bumps
Nanoindentation Measurement of Hardness & Modulus as a Function of Time & Temperature
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Mechanical Characterization of Ultra Low-k Dielectric Films
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Thermal Expansion Study in a TSV-Structure
In-Situ Imaging From 23°C to 400°C in a Controlled Sample Micro-Environment
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Microtribology of Solid Lubricant Coatings for MEMS
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MEMS Slider Friction Characterization
Actuation of MEMS Devices with the Hysitron TriboIndenter®
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Full Nanomechanical Characterization of Ultra-Thin Films
Nanoindentation, Nanoscratch, and ScanningWear™ of TiN Thin Films on the TI 950 TriboIndenter®
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