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The World Leader in Developing Nanomechanical Test Instruments for Materials Research

Hysitron® is the world leader in developing nanomechanical test instruments and has designed cutting edge technology for the scientific community since 1992. As the pioneers of in situ imaging with nanomechanical property measurement capabilities, Hysitron has grown with the nanotechnology market for over two decades.

In addition to nanoindentation and microindentation, Hysitron's nanoindenter instrument capabilities include tribology, modulus mapping, dynamic mechanical analysis, acoustic emission monitoring, electrical contact resistance and in situ SEM and TEM nanomechanical testing. Our nanoindenter instruments are custom designed to solve your nanomechanical property needs and our team of expert scientists is always on hand to answer your questions and help solve your problems.

 

Nanoindentation and Nanomechanical Material Characterization News & Events

International Interconnect Technology Conference (IITC 2015)
Join Hysitron at IITC, May 18-21 in Grenoble, France.
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IEEE Electronic Components and Technology Conference (ECTC 2015) - Booth 607
Join Hysitron at ECTC, May 26-29 in San Diego, CA.
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SEM 2015 Annual Conference and Exposition on Experimental and Applied Mechanics - Booth 102
Join Hysitron at SEM 2015, June 8-11 in Costa Mesa, CA.
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